Organic EL element, organic EL display panel using same, and organic EL display panel manufacturing method

ABSTRACT

An organic EL display panel in which pixels are arranged in a matrix, including: light-emitting layers disposed above pixel electrode layers in intervals between adjacent ones of column banks; an opposing electrode layer disposed above the light-emitting layers, the opposing electrode layer including a light-transmissive material; column light-shielding layers disposed higher than the pixel electrode layers, extending in the column direction, arranged side-by-side in the row direction, and overlapping row-direction edge portions of the pixel electrode layers in plan view of a substrate; and row light-shielding layers disposed higher than the pixel electrode layers, extending in the row direction, arranged side-by-side in the column direction, overlapping column-direction edge portions of the pixel electrode layers and partially overlapping contact regions in plan view of the substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application is based on application No. 2015-175758 filed in Japan,the contents of which are hereby incorporated by reference.

BACKGROUND OF THE DISCLOSURE

(1) Technical Field

The present disclosure relates to organic electroluminescence (EL)elements that use electroluminescence of organic material, organic ELdisplay panels that use the organic EL elements, and organic EL displaypanel manufacturing methods.

(2) Description of Related Art

In recent years, as display panels used in display devices such asdigital televisions, organic EL display panels are being implemented inwhich a plurality of organic EL elements are arrayed in a matrix on asubstrate. Such organic EL display panels have high visibility, becauseeach organic EL element is self-luminous.

In an organic EL display panel, each organic EL element typically has astructure in which a light-emitting layer that includes an organiclight-emitting material is disposed between an anode and cathode pair ofelectrodes. When driven, a voltage is applied between the pair ofelectrodes, holes are injected to the light-emitting layer from theanode, electrons are injected to the light-emitting layer from thecathode, and the holes and the electrons recombine to emit light.

In the organic EL display panel, light-emitting layers are typicallyseparated from adjacent organic EL elements by banks composed of aninsulative material. In an organic EL display panel for color display,such organic EL elements form RGB color pixels, one pixel in a colordisplay being formed by a combination of adjacent RGB pixels.

Typically, in an organic EL display panel, in order to prevent leakingof light between adjacent pixels and mixing of colors of lightassociated with this, a lattice-shaped light-shielding layer is providedabove the banks at boundaries between adjacent pixels. For example, WO2013108783 discloses an organic EL element that suppresses a decrease inaperture ratio while also preventing color mixing between adjacentpixels, by using a matrix-shaped light-shielding member that hasdifferent thicknesses above a color filter substrate. Further, JP2015-72827 discloses an organic EL display device that has an elementsubstrate on which a light-emitting layer and a light-shielding memberare disposed, and has a color filter layer that includes colored layersof multiple colors and an inter-pixel light-shielding member betweencolored layers. The light-shielding member is disposed more centrally ineach pixel than the inter-pixel light-shielding member and therebysuppresses parallax mixed color due to light leakage to adjacent pixelsand obtains high light extraction efficiency.

SUMMARY OF THE DISCLOSURE (1) Problems to be Solved

However, as resolution of a display panel is increased, element area foreach pixel is reduced, but width of a shielding layer required toprevent light leakage to adjacent pixels is maintained regardless ofreduction in element area. Thus, as resolution increases, aperture ratioof the shielding layer decreases, and a reduction in light emissionefficiency based on a reduction in light emission area per pixel areabecomes a technical problem. In contrast, when reducing the shieldinglayer in order to increase aperture ratio, there is a concern thatdisplay contrast decreases due to glare from external light reflectedfrom reflective electrodes of the display panel.

In view of the above, the present disclosure aims to provide an organicEL element that improves suppression of glare from external light on adisplay surface and improves light emission efficiency, an organic ELdisplay panel using the organic EL element, and a method ofmanufacturing the organic EL display panel.

(2) Means for Solving the Problems

In order to achieve this aim, an organic EL display panel pertaining toone aspect of the technology described in the present disclosure is anorganic EL display panel in which a plurality of pixels are arranged ina row direction and a column direction in a matrix, the organic ELdisplay panel including: a substrate; a plurality of pixel electrodelayers arranged in the row direction and the column direction in amatrix on the substrate, the pixel electrode layers including alight-reflective material; a plurality of column banks disposed on thesubstrate and on the pixel electrode layers, covering row-direction edgeportions of the pixel electrode layers, extending in the columndirection, arranged side-by-side in the row direction, and definingrow-direction edges of self-luminous regions of the pixels; a pluralityof row banks disposed on the substrate and on the pixel electrodelayers, covering column-direction edge portions of the pixel electrodelayers and contact regions of the pixel electrode layers that are forelectrically connecting the pixel electrode layers, extending in the rowdirection, arranged side-by-side in the column direction, and definingcolumn-direction edges of the self-luminous regions; a plurality oflight-emitting layers disposed above the pixel electrode layers inintervals between adjacent ones of the column banks; an opposingelectrode layer disposed above the light-emitting layers, the opposingelectrode layer including a light-transmissive material; a plurality ofcolumn light-shielding layers disposed higher than the pixel electrodelayers, extending in the column direction, arranged side-by-side in therow direction, and overlapping the row-direction edge portions of thepixel electrode layers in plan view of the substrate; and a plurality ofrow light-shielding layers disposed higher than the pixel electrodelayers, extending in the row direction, arranged side-by-side in thecolumn direction, overlapping the column-direction edge portions of thepixel electrode layers and partially overlapping the contact regions inplan view of the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other objects, advantages, and features of the technologypertaining to the present disclosure will become apparent from thefollowing description thereof taken in conjunction with the accompanyingdrawings, which illustrate at least one specific embodiment of thetechnology pertaining to the present disclosure.

FIG. 1 is a schematic block diagram illustrating a configuration of adisplay device 1 pertaining to an embodiment.

FIG. 2 is a schematic circuit diagram showing a circuit configuration ofa pixel 100 e of an organic EL display panel 10 used in the displaydevice 1.

FIG. 3 is a schematic plan view illustrating a portion of the organic ELdisplay panel 10.

FIG. 4 is a schematic cross-sectional view of A-A in FIG. 3.

FIG. 5 is a schematic cross-sectional view of B-B in FIG. 3.

FIG. 6A, FIG. 6B, FIG. 6C, FIG. 6D, and FIG. 6E are schematiccross-sectional views illustrating states of processes in manufacturingthe organic EL display panel 10.

FIG. 7A, FIG. 7B, and FIG. 7C are schematic cross-sectional viewsillustrating states of processes in manufacturing the organic EL displaypanel 10.

FIG. 8A, FIG. 8B, FIG. 8C, FIG. 8D, FIG. 8E, and FIG. 8F are schematiccross-sectional views illustrating states of processes in manufacturingthe organic EL display panel 10.

FIG. 9A and FIG. 9B are schematic cross-sectional views illustratingstates of processes in manufacturing the organic EL display panel 10.

FIG. 10 is an enlarged plan view of a portion A in FIG. 3.

FIG. 11A, FIG. 11B, and FIG. 11C are plan view photographs of the pixel100 e of the organic EL display panel 10, captured from above an uppersubstrate 130.

FIG. 12A, FIG. 12B, and FIG. 12C are plan view photographs of the pixel100 e of the organic EL display panel when emitting light, captured fromabove the upper substrate.

FIG. 13 is a schematic cross-sectional view at the same position as A-Ain FIG. 3, of an organic EL display panel 10A pertaining to amodification.

FIG. 14 is a schematic cross-sectional view at the same position as B-Bin FIG. 3, of the organic EL display panel 10A pertaining to amodification.

DESCRIPTION OF EMBODIMENT Summary of Embodiment

An organic EL display panel pertaining to the present embodiment is anorganic EL display panel in which a plurality of pixels are arranged ina row direction and a column direction in a matrix, the organic ELdisplay panel including: a substrate; a plurality of pixel electrodelayers arranged in the row direction and the column direction in amatrix on the substrate, the pixel electrode layers including alight-reflective material; a plurality of column banks disposed on thesubstrate and on the pixel electrode layers, covering row-direction edgeportions of the pixel electrode layers, extending in the columndirection, arranged side-by-side in the row direction, and definingrow-direction edges of self-luminous regions of the pixels; a pluralityof row banks disposed on the substrate and on the pixel electrodelayers, covering column-direction edge portions of the pixel electrodelayers and contact regions of the pixel electrode layers that are forelectrically connecting the pixel electrode layers, extending in the rowdirection, arranged side-by-side in the column direction, and definingcolumn-direction edges of the self-luminous regions; a plurality oflight-emitting layers disposed above the pixel electrode layers inintervals between adjacent ones of the column banks; an opposingelectrode layer disposed above the light-emitting layers, the opposingelectrode layer including a light-transmissive material; a plurality ofcolumn light-shielding layers disposed higher than the pixel electrodelayers, extending in the column direction, arranged side-by-side in therow direction, and overlapping the row-direction edge portions of thepixel electrode layers in plan view of the substrate; and a plurality ofrow light-shielding layers disposed higher than the pixel electrodelayers, extending in the row direction, arranged side-by-side in thecolumn direction, overlapping the column-direction edge portions of thepixel electrode layers and partially overlapping the contact regions inplan view of the substrate.

Further, according to an example of the embodiment, a plurality ofthin-film transistors are arranged in the row direction and the columndirection in a matrix in the substrate, in positions corresponding tothe pixels, wherein sources or drains of the thin-film transistors areconnected to the pixel electrode layers via connecting recesses in whichportions of the pixel electrode layers in the contact regions arerecessed in the direction of the substrate, and in plan view of thesubstrate, the row light-shielding layers do not overlap with theconnecting recesses.

According to an example of the embodiment, the light-emitting layersextend continuously in the column direction above the row banks.

According to an example of the embodiment, the light-emitting layers areinterrupted by the row banks.

According to an example of the embodiment, any two of the light-emittinglayers disposed in the intervals between the column banks that areadjacent to each other in the row direction emit different colors oflight from each other.

According to an example of the embodiment, any one of the light-emittinglayers interrupted by the row banks in the column direction emits thesame color of light along its length in the column direction.

According to an example of the embodiment, an upper substrate isdisposed above the opposing electrode, the upper substrate including alight-transmissive material, wherein the row light-shielding layers andthe column light-shielding layers are disposed in direct contact withthe upper substrate.

According to an example of the embodiment, an upper substrate isdisposed above the opposing electrode, the upper substrate including alight-transmissive material, wherein the row light-shielding layers, thecolumn light-shielding layers, or both the row light-shielding layersand the column light-shielding layers are disposed in direct contactwith the upper substrate.

According to an example of the embodiment, an upper substrate isdisposed above the opposing electrode, the upper substrate including alight-transmissive material, wherein the row light-shielding layers andthe column light-shielding layers are disposed in direct contact withthe upper substrate.

According to an example of the embodiment, the column light-shieldinglayers are disposed on upper surfaces of the column banks.

According to an example of the embodiment, the row light-shieldinglayers are disposed on upper surfaces of the row banks.

An organic EL element pertaining to the present embodiment is an organicEL element including: a substrate; a pixel electrode layer disposed onthe substrate, the pixel electrode layer including a light-reflectivematerial; banks disposed on the substrate and on the pixel electrodelayer, covering edge portions of the pixel electrode layer and a portionof a contact region of the pixel electrode layer, the contact regionbeing for electrically connecting the pixel electrode layer; alight-emitting layer disposed above the pixel electrode layer; anopposing electrode layer disposed above the light-emitting layer, theopposing electrode layer including a light-transmissive material; and alight-shielding layer disposed higher than the pixel electrode layer,the light-shielding layer overlapping the edge portions of the pixelelectrode layers and partially overlapping the contact region in planview of the substrate.

A method of manufacturing an organic EL display panel pertaining to thepresent embodiment is a method including: preparing a substrate;disposing a plurality of pixel electrode layers in a row direction and acolumn direction in a matrix on the substrate, the pixel electrodelayers including a light-reflective material; disposing a plurality ofcolumn banks on the substrate and on the pixel electrode layers, thecolumn banks covering row-direction edge portions of the pixel electrodelayers, extending in the column direction, and arranged side-by-side inthe row direction; disposing a plurality of row banks on the substrateand on the pixel electrode layers, the row banks coveringcolumn-direction edge portions of the pixel electrode layers, extendingin the row direction, and arranged side-by-side in the column direction;disposing a plurality of light-emitting layers above the pixel electrodelayers in intervals between adjacent ones of the column banks; disposingan opposing electrode layer above the light-emitting layers, theopposing electrode layer including a light-transmissive material;disposing, higher than the pixel electrode layers, a plurality of rowlight-shielding layers extending in the row direction, arrangedside-by-side in the column direction, and overlapping thecolumn-direction edge portions of the pixel electrode layers in planview of the substrate; and disposing, higher than the pixel electrodelayers, a plurality of column light-shielding layers extending in thecolumn direction, arranged side-by-side in the row direction,overlapping the row-direction edge portions of the pixel electrodelayers and partially overlapping the contact regions in plan view of thesubstrate.

Embodiment

1. Overall Configuration of Display Device 1

The following describes an overall configuration of the display device 1pertaining to the embodiment, with reference to FIG. 1.

As illustrated in FIG. 1, the display device 1 pertaining to the presentembodiment includes an organic EL display panel 10 (hereinafter referredto as “display panel 10”) and a drive control circuit 20 connectedthereto.

The display panel 10 is an organic electroluminescence (EL) panel thatuses electroluminescence of organic material, in which a plurality oforganic EL elements are, for example, arrayed in a matrix. The drivecontrol circuit 20 comprises four drive circuits 21, 22, 23, 24 and acontrol circuit 25.

The arrangement of circuits of the drive control circuit 20 with respectto the display panel 10 in the display device 1 is not limited to theconfiguration illustrated in FIG. 1.

2. Circuit Configuration in Display Panel 10

The following describes circuit configuration of organic EL elements 100included in pixels in the display panel 10, with reference to FIG. 2.FIG. 2 is a schematic circuit diagram showing a circuit configuration ineach of the organic EL elements 100, which correspond to pixels 100 e ofthe organic EL display panel 10 used in the display device 1. As shownin FIG. 2, in the display panel 10 pertaining to the present embodiment,each of the organic EL elements 100 in the pixels 100 e includes twotransistors Tr1, Tr2, a capacitor C, and an EL element portion EL as alight-emitter. Of the two transistors Tr1, Tr2, the transistor Tr1 is adrive transistor and the transistor Tr2 is a switching transistor.

A gate G2 of the switching transistor Tr2 is connected to a scan lineVscn and a source S2 is connected to a data line Vdat. A drain D2 of theswitching transistor Tr2 is connected to a gate G1 of the drivetransistor Tr1.

A drain D1 of the drive transistor Tr1 is connected to a power supplyline Va, and a source S1 is connected to a pixel electrode layer (anode)of the EL element portion EL. An opposing electrode layer (cathode) ofthe EL element portion EL is connected to a ground line Vcat.

The capacitor C connects the drain D2 of the switching transistor Tr2,the gate G1 of the drive transistor Tr1, and the power supply line Va.

In the display panel 10, the organic EL elements 100 in the pixels 100 ethat each have the circuit configuration shown in FIG. 2 are disposed ina matrix to form a display region.

3. Overall Configuration of Organic EL Display Panel 10

The following describes the display device 10 pertaining to theembodiment, with reference to the drawings. The drawings are schematicdiagrams, and scale may be different from an actual implementation.

FIG. 3 is a schematic plan view illustrating a portion of a displaypanel pertaining to the embodiment. The display panel 10 is an organicEL display panel that uses electroluminescence of an organic compound,and has a top-emission configuration emitting light from an uppersurface thereof, in which a plurality of the organic EL elements 100 arearranged in a matrix on a substrate 100 x (TFT substrate) on which thinfilm transistors (TFT) are disposed. As shown in FIG. 3, in the displaypanel 10, the organic EL elements 100 that make up pixels are disposedin a matrix.

In the display panel 10, in the pixels 100 e, self-luminous regions 100a are formed, which are regions that emit light by using an organiccompound. The self-luminous regions 100 a are in three varieties, aregion that emits red light 100 aR, a region that emits green light 100aG, and a region that emits blue light 100 aB (hereinafter, when 100 aR,100 aG, 100 aB are not distinguished they are referred to by “100 a”).Three self-luminous regions 100 aR, 100 aG, 100 aB lined up in a rowdirection are a set that make up one pixel in a color display.

As shown in FIG. 3, in the display panel 10, a plurality of pixelelectrode layers 119 are arranged in a matrix on the substrate 100 x.The pixel electrode layers 119 each have a rectangular shape in planview and include a light-reflective material.

In the display panel 10, elongated banks are used, each bank of columnbanks 122Y extending in a column direction (direction 3Y in thedrawings) and the column banks 122Y being arranged side-by-side in a rowdirection. Each of the column banks 122Y is disposed above row-directionedge portions of two of the pixel electrode layers 119 that are adjacentin the row direction.

When gaps between adjacent ones of the column banks 122Y are defined asintervals 122 z, the display panel 10 has a configuration in which thecolumn banks 122Y and the intervals 122 z alternate in the rowdirection. The intervals are sub-divided into red intervals 122 zR thatcorrespond to the self-luminous regions 100 aR, green intervals 122 zGthat correspond to the self-luminous regions 100 aG, and blue intervals122 zB that correspond to the self-luminous regions 100 aB (hereinafter,when the red intervals 122 zR, the green intervals 122 zG, and the blueintervals 122 vB are not distinguished they are collectively referred toas the intervals 122 z). Row-direction edges of the self-luminousregions 100 a are defined by row-direction edges of the column banks122Y.

In the intervals 122 z, each bank of row banks 122X extends in a rowdirection (direction X in FIG. 3) and the row banks 122X are arrangedside-by-side in a column direction. Each of the row banks 122X isdisposed above column-direction edges of two adjacent ones of the pixelelectrode layers 119 that are adjacent in the column direction. In theintervals 122 z, regions in which the row banks 122X are disposed becomenot-self-luminous regions 100 b. Thus, edges of the self-luminousregions 100 a in the column direction are defined by column-directionedges of the row banks 122X. In the intervals 122 z, the self-luminousregions 100 a and the not-self-luminous regions 100 b alternate in thecolumn direction. In the not-self-luminous regions 100 b are disposedconnection recesses 119 c that connect the pixel electrode layers 119 tothe sources S1 of the TFTs via connecting electrode layers 117, andcontact regions 119 b (contact windows) on the pixel electrode layers119 for electrically connecting the pixel electrode layers 119.

The column banks 122Y and the row banks 122X are orthogonal to eachother, and the row banks 122X overlap with the self-luminous regions 100a in the column direction (hereinafter, when the row banks 122X and thecolumn banks 122Y are not distinguished, they are referred to as thebanks 122). Further, above the pixel electrode layers 119, columnlight-shielding layers 129Y are disposed that overlap with row-directionedge portions of the pixel electrode layers 119, and row light-shieldinglayers 129X are disposed that overlap with column-direction edgeportions of the pixel electrode layers 119 and do not overlap withportions of the contact regions 119 b.

4. Elements of Display Panel 10

The following describes configuration of the organic EL elements 100 inthe display panel 10 with reference to the schematic cross-sectionalviews of FIG. 4 and FIG. 5. FIG. 4 is a schematic cross-sectional viewof A-A in FIG. 3. FIG. 5 is a schematic cross-sectional view of B-B inFIG. 3.

The display panel 10 pertaining to the present embodiment is atop-emission type of organic EL display panel. In a Z axis direction ata lower end thereof is the substrate 100 x (TFT substrate) includingthin film transistors. On the substrate 100 x is disposed an organic ELelement portion.

4.1 Substrate 100 x (TFT Substrate)

As illustrated in FIG. 4, gate electrodes 101, 102 are disposed on alower substrate 100 p, and a gate insulating layer 103 is disposedcovering the gate electrodes 101, 102 and a surface of the substrate 100x. Channel layers 104, 105 corresponding to the gate electrodes 101, 102are disposed on the gate insulating layer 103. A channel protectionlayer 106 is disposed covering the channel layers 104, 105 and a surfaceof the gate insulating layer 103.

On the channel protection layer 106, source electrodes 107 and drainelectrodes 108 are disposed with intervals therebetween, correspondingto the gate electrodes 101 and the channel layers 104. Similarly, sourceelectrodes 110 and drain electrodes 109 are disposed with intervalstherebetween, corresponding to the gate electrodes 102 and the channellayers 105.

Under the source electrodes 107, 110 and the drain electrodes 108, 109are disposed source lower electrodes 111, 115 and drain lower electrodes112, 114, penetrating the channel protection layer 106. At Z axisdirection lower portions thereof, the source lower electrodes 111 andthe drain lower electrodes 112 are in contact with the channel layers104. At Z axis direction lower portions thereof, the drain lowerelectrodes 114 and the source lower electrodes are in contact with thechannel layers 105.

Further, the drain electrodes 108 and the gate electrodes 102 areconnected to each other by connector plugs 113, which penetrate the gateinsulating layer 103 and the channel protection layer 106.

The gate electrodes 101 correspond to the gate G2 in FIG. 2, the sourceelectrodes 107 correspond to the source S2 in FIG. 2, and the drainelectrodes 108 correspond to the drain D2 in FIG. 2. Similarly, the gateelectrodes 102 correspond to the gate G1 in FIG. 1, the sourceelectrodes 110 correspond to the source S1 in FIG. 1, and the drainelectrodes 109 correspond to the drain D1 in FIG. 1. Accordingly, theswitching transistor Tr2 is formed at a Y axis direction left-hand sideof FIG. 4, and the drive transistor Tr1 is formed further right in the Yaxis direction of FIG. 4.

However, the configuration described above is merely an example, and thetransistors Tr1, Tr2 may be configured as top-gate type, bottom-gatetype, channel etch type, etch stop type, etc., transistors, and are notlimited to the configuration illustrated in FIG. 4.

A passivation layer 116 is disposed covering the source electrodes 107,110, the drain electrodes 108, 109, and the channel protection layer106. Contact holes 116 a are formed in the passivation layer 116 aboveportions of the source electrodes 110, and connecting electrode layers117 are layered to follow the contours of the contact holes 116 a.

In the Z axis direction, lower portions of the connecting electrodelayers 117 are connected to the source electrodes 110 and parts of upperportions of the connecting electrode layers 117 are on the passivationlayer 116. An interlayer insulating layer 118 is disposed on andcovering the connecting electrode layers 117 and the passivation layer116.

4.2 Organic EL Element Portion

(1) Pixel Electrode Layers 119

For each pixel, one of the pixel electrode layers 119 is disposed on theinterlayer insulating layer 118. The pixel electrode layers 119 supplycarriers to the light-emitting layers 123; for example, when functioningas anodes they supply holes to the light-emitting layers 123. Further,the panel 10 is a top-emission type, and therefore the pixel electrodelayers 119 are light-reflective. Each of the pixel electrode layers 119has a flat rectangular shape. The pixel electrode layers 119 aredisposed on the substrate 100 x with intervals δX therebetween in therow direction and intervals δY therebetween in the column direction inthe intervals 122 z. Further, the connecting recesses 119 c of the pixelelectrode layers 119 are connected to the connecting electrode layers117 via contact holes 118 a formed in the connecting electrode layers117 and the interlayer insulating layer 118. Thus, via the connectingelectrode layers 117, the pixel electrode layers 119 and the source S1of the TFT are connected.

The connecting recesses 119 c are concavities in portions of the pixelelectrode layers 119, recessed towards the substrate 100 x, composed ofbottom portions 119 c 1 and inner peripheral surface portions 119 c 2.Surfaces of the inner peripheral surface portions 119 c 2 are preferablyconical (tapered) inclined slopes. This is in order that a portion oflight that leaks in the column direction from the light-emitting layers123 can be reflected upwards.

(2) Hole Injection Layers 120, Hole Transport Layers 121

Hole injection layers 120 and hole transport layers 121 are disposed inthis order on the pixel electrode layers 119, the hole transport layers121 being in contact with the hole injection layers 120. The holeinjection layers 120 and the hole transport layers 121 have the functionof transporting holes injected from the pixel electrode layers 119 tothe light-emitting layers 123.

(3) Banks 122

The banks 122 are disposed covering edges of the pixel electrode layers119, the hole injection layers 120, and the hole transport layers 121.The banks 122 include an insulative material. The banks 122 includecolumn banks 122Y that extend in the column direction and are lined upin the row direction, and row banks 122X that extend in the rowdirection and are lined up in the column direction. The column banks122Y and the row banks 122X form a lattice shape.

The column banks 122Y prevent flow in the row direction of inkcontaining an organic compound that is a material of the light-emittinglayers 123, and define row-direction edges of the light-emitting layers123. The column banks 122Y are disposed above edge portions 119 a 3, 119a 4 in the row direction of the pixel electrode layers 119, coveringportions of the pixel electrode layers 119.

The row banks 122X are for suppressing flow in the column direction ofink containing the organic compound that is a material of thelight-emitting layers 123. The row banks 122X are disposed above edgeportions 119 a 1, 119 a 2 in the column direction of the pixel electrodelayers 119, covering portions of the pixel electrode layers 119. Thus,the row banks 122X define edges of self-luminous regions of pixels inthe column direction, as described above. The row banks 122X linearlyextend in the row direction and a cross-section taken parallel to thecolumn direction shows a trapezoidal shape that tapers upwards. The rowbanks 122X pass through the column banks 122Y, following the rowdirection that is perpendicular to the column direction. The row banks122X have upper surfaces that are lower than upper surfaces of thecolumn banks 122Y. Thus, openings corresponding to the self-luminousregions 100 a are formed by the rows banks 122X and the column banks122Y.

(4) Light-Emitting Layers 123

The display panel 10 has a configuration in which the column banks 122Yand the intervals 122 z alternate in the row direction. Thelight-emitting layers 123 are formed in the intervals 122 z, which aredefined by the column banks 122Y, and extend in the column direction.The light-emitting layers 123 that emit light of the following colorsare disposed in the red intervals 122 zR that correspond to theself-luminous regions 100 aR, the green intervals 122 zG that correspondto the self-luminous regions 100 aG, and the blue intervals 122 zB thatcorrespond to the self-luminous regions 100 aB.

The light-emitting layers 123 are layers including organic compounds andhave a function of emitting light due to recombination of holes andelectrons therein. In the intervals 122 z, the light-emitting layers 123extend linearly in the column direction.

The light-emitting layers 123 emit light only from portions thereof thatare supplied with carriers from the pixel electrode layers 119, andtherefore electroluminescence of organic compounds does not occur inareas in which the row banks 122X are present, the row banks 122X beinginter-layer insulators. Thus, the light-emitting layers 123 emit lightonly from portions where the row banks 122X are not present, theseportions are the self-luminous regions 100 a, and edges of theself-luminous regions 100 a in the column direction are defined by edgesof the row banks 122X in the column direction.

Portions of the light-emitting layers 123 above the row banks 122X donot emit light and these portions are the not-self-luminous regions 100b. In other words, the not-self-luminous regions 100 b are regionsobtained by projecting the row banks 122X in a plan view direction. Thelight-emitting layers 123 are disposed on upper surfaces of the holetransport layers 121 in the self-luminous regions 100 a and on upper andside surfaces of the row banks 122X in the not-self-luminous regions 100b.

As illustrated in FIG. 4, the light-emitting layers 123 extend into thenot-self-luminous regions 100 b that are contiguous, and not only theself-luminous regions 100 a. Thus, when forming the light-emittinglayers 123, ink applied to the self-luminous regions 100 a can flow inthe column direction via ink applied to the not-self-luminous regions100 b, and film thickness thereof can be planarized between pixels inthe column direction. However, in the not-self-luminous regions 100 b,flow of ink is appropriately suppressed by the row banks 122X.Accordingly, large irregularities in film thickness in the columndirection are unlikely to occur, and irregularity in luminance of eachpixel is improved.

(5) Electron Transport Layer 124

The electron transport layer 124 is disposed on the banks 122 and on thelight-emitting layers 123 in the openings defined by the banks 122.Further, in the present example, the electron transport layer 124 isalso disposed on the column banks 122Y that are exposed above thelight-emitting layers 123. The electron transport layer 124 has thefunction of transporting electrons injected from the opposing electrodelayer 125 to the light-emitting layers 123.

(6) Opposing Electrode Layer 125

The opposing electrode layer 125 is disposed on the electron transportlayer 124, covering the electron transport layer 124. The opposingelectrode layer 125 is disposed continuously across an entire surface ofthe display panel 10 and may be connected to bus bar wiring per pixel,or per plurality of pixels (not illustrated). The opposing electrodelayer 125 creates electrical paths by opposing the pixel electrodelayers 119, sandwiching the light-emitting layers 123, and suppliescarriers to the light-emitting layers 123. For example, when theopposing electrode layer 125 functions as a cathode, it supplieselectrons to the light-emitting layers 123. The opposing electrode 125conforms to the surface of the electron transport layer 124 and is acommon electrode across the light-emitting layers 123.

The opposing electrode 125 uses a light-transmissive electricallyconductive material, because the display panel 10 is a top-emissiontype. For example, indium tin oxide (ITO) or indium zinc oxide (IZO) maybe used. Further, silver (Ag) or aluminium (Al) may be used as a thinfilm electrode.

(7) Sealing Layer 126

The sealing layer 126 is disposed on the opposing electrode layer 125,covering the opposing electrode layer 125. The sealing layer 126 is forsuppressing degradation of the light-emitting layer 123 due to contactwith moisture, air, etc. The sealing layer 126 is disposed across anentire surface of the display panel 10, covering an upper surface of theopposing electrode layer 125. As a material of the sealing layer 126, alight-transmissive material is used such as silicon nitride or siliconoxynitride, because the display panel 10 is a top-emission type.

(8) Joining Layer 127

Above the sealing layer 126 in the Z axis direction is disposed a CFsubstrate 131, joined to the sealing layer 126 by the joining layer 127.The CF substrate includes the upper substrate 130 and color filterlayers 128 and the light-shielding layers 129 below the upper substratein the Z axis direction. The joining layer 127 has a function of joininga back panel, in other words each layer from the substrate 100 x to thesealing layer 126, to the CF substrate 131, and a function of preventingeach layer from being exposed to moisture or air.

(9) Upper Substrate 130

The CF substrate 131 is disposed on and joined to the joining layer 127.The CF substrate 131 includes the upper substrate 130, the color filterlayers 128, and the shielding layers 129. For the upper substrate 130, alight-transmissive material is used such as cover glass orlight-transmissive resin film, because the display panel 10 is atop-emission type. Further, the upper substrate 130 can improvestiffness of the display panel 10 and prevent penetration of the displaypanel 10 by moisture or air.

(10) Color Filter Layers 128

Color filter layers 128 are disposed under the upper substrate 130 atlocations corresponding to the self-luminous regions 100 a of each colorof pixel. The color filter layers 128 are light-transmissive layers fortransmitting visible light of wavelengths corresponding to red, green,and blue, and have a function of transmitting light emitted from eachcolor of pixel and correcting the chromaticity thereof. In the presentexample, above the self-luminous regions 100 aR in the red intervals 122zR, the self-luminous regions 100 aG in the green intervals 122 zG, andthe self-luminous regions 100 aB in the blue intervals, are disposed redcolor filter layers 128R, green color filter layers 128G, and blue colorfilter layers 128B, respectively. The color filter layers 128 areformed, for example, by a process of applying ink containing a colorfilter material and a solvent to the upper substrate 130, the uppersubstrate 130 being made from cover glass that has openingscorresponding to pixels in a matrix for forming color filters.

(11) Light-Shielding Layer 129

The light-shielding layer 129 is disposed under the upper substrate 130in locations corresponding to boundaries between the self-luminousregions 100 a of pixels.

The light-shielding layer 129 is a black resin layer for preventingtransmission of visible light in wavelengths corresponding to red,green, and blue. For example, the light-shielding layer 129 is composedof a resin material that includes black pigment that has excellentlight-absorbing and light-shielding properties. The light-shieldinglayer 129 is intended to prevent entry of external light into thedisplay panel 10, prevent visibility of internal parts through the uppersubstrate 130, and improve contrast of the display panel 10 to suppressglare from external light. Glare from external light is a phenomenoncaused by external light entering the display panel 10 from above theupper substrate 130, being reflected at the pixel electrode layers 119,and being emitted from the upper substrate 130.

Further, the light-shielding layer 129 has a function of preventing, byblocking a portion of light emitted from a pixel that leaks to adjacentpixels, boundaries between pixels becoming unclear, and has a functionof increasing color purity of light emitted from pixels.

The light-shielding layer 129 includes column light-shielding layers129Y that extend in the column direction and are lined up in the rowdirection, and row light-shielding layers 129X that extend in the rowdirection are lined up in the column direction, the columnlight-shielding layers 129Y and the row light-shielding layers 129Xforming a matrix.

In the organic EL elements 100, the column light-shielding layers 129Yare disposed in positions overlapping row-direction edge portions 119 a3, 119 a 4 of the pixel electrode layers 119 (hereinafter, when 119 a 3and 119 a 4 are not distinguished, they are referred to as “edgeportions 119 a”), as illustrated in FIG. 5, and the row light-shieldinglayers 129X are disposed in positions overlapping column-direction edgeportions 119 a 1, 119 a 2 of the pixel electrode layers 119(hereinafter, when 119 a 1 and 119 a 2 are not distinguished, they arereferred to as “edge portions 119 a”), as illustrated in FIG. 4. Thus, awidth WX in the row direction of the column light-shielding layers 129Yis greater than a distance δX in the row direction between adjacent onesof the pixel electrode layers 119, and a width WY in the columndirection of the row light-shielding layers 129X is greater than adistance δY in the column direction between adjacent ones of the pixelelectrode layers 119. Thus, external light reflection in the displaypanel 10 can be effectively suppressed by arrangement of thelight-shielding layer 129 above edge portions of the pixel electrodelayers 119.

In the organic EL elements 100, as described above, the self-luminousregions 100 a and the not-self-luminous regions 100 b are arrangedalternating with each other in the column direction. When regions whererow banks 122X overlap with portions of the pixel electrode layers 119nearest the edge portions 119 a 2 of the pixel electrode layers 119 onthe side of the connecting recesses 119 c are defined as contact regions119 b of the pixel electrode layers 119 for electrically connecting thepixel electrode layers 119, the row light-shielding layers 129X aredisposed in positions that do not overlap with portions of the contactregions 119 b of the pixel electrode layers 119, as illustrated in FIG.4. According to this configuration, light emission efficiency of theorganic EL elements 100 is improved. The improvement in light emissionefficiency is described later.

4.3 Materials

The following illustrates one example of materials of elements shown inFIG. 4 and FIG. 5.

(1) Substrate 100 x (TFT Substrate)

As the lower substrate 100 p, for example, a glass substrate, a silicaglass substrate, a metal substrate such as molybdenum sulfide, copper,zinc, aluminium, stainless steel, magnesium, iron, nickel, gold, orsilver, a semiconductor substrate based on gallium arsenide, or aplastic substrate can be used.

As a plastic material, any thermoplastic or thermosetting resin may beused. For example, polyolefin such as polyethylene, polypropylene,ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA),cyclic polyolefin, modified polyolefin, polyvinyl chloride,polyvinylidene chloride, polystyrene, polyamide, polyimide (PI),polyamide-imide, polycarbonate, poly-(4-methyl-1-pentene), ionomer,acrylic resin, polymethyl methacrylate, styrene acrylonitrile copolymer(SAN), butadiene styrene copolymer, ethylene vinyl alcohol (EVOH),polyethylene terephthalate (PET), polybutylene terephthalate,polyethylene naphthalate (PEN), polyester such aspolycyclohexylenedimethylene terephthalate (PCT), polyether, polyetherketone, polyether sulfone (PES), polyetherimide, polyacetal,polyphenylene oxide, modified polyphenylene oxide, polyarylate, aromaticpolyester (liquid crystal polymer), polytetrafluoroethylene,polyvinylidene fluoride, other fluorine-based resins, variousthermoplastic elastomers such as styrene-, polyolefin-, polyvinylidenechloride-, polyurethane-, fluorine rubber-, or chlorinatedpolyethylene-based thermoplastic elastomers, epoxy resin, phenol resin,urea resin, melamine resin, unsaturated polyester, silicone resin,polyurethane, or a copolymer, blend, polymer alloy, etc., primarilyconsisting of one of the above, or a layered body including layers ofone or more of the above can be used.

As the gate electrodes 101, 102, a layered body of copper (Cu) andmolybdenum (Mo) can be used, for example. The material of the gateelectrodes 101, 102 is not limited to this example, and other metalmaterial may be used.

As a material of the gate electrode layer 103, as long as the materialis electrically insulating a known organic material or inorganicmaterial can be used, such as silicon oxide (SiO₂) or silicon nitride(SiNx), for example.

As the channel layers 104, 105, an oxide semiconductor including atleast one material selected from indium (In), gallium (Ga), and zinc(Zn) can be used.

As a material of the channel protection layer 106, silicon oxynitride(SiON), silicon nitride (SiN), or aluminium oxide (AlOx) can be used,for example.

As the source electrodes 107, 110, and the drain electrodes 108, 109,layered bodies of copper-manganese (CuMn), copper (Cu), and molybdenum(Mo) can be used, for example.

Further, the source lower electrodes 111, 115 and the drain lowerelectrodes 112, 114 can be configured using the same materials as thesource electrodes 107, 110 and the drain electrodes 108, 109.

The passivation layer 116 may use silicon oxide (SiO2), silicon nitride(SiN), or silicon oxynitride (SiON).

As the connecting electrode layers 117, layered bodies of molybdenum(Mo), copper (Cu), and copper-manganese (CuMn) may be used (Mo approx.20 nm, Cu approx. 375 nm, and CuMn approx. 65 nm). However, thickness ofeach layer is not limited to this example, and thickness of a molybdenum(Mo) layer may be in a range from 5 nm to 200 nm, thickness of a copper(Cu) layer may be in a range from 50 nm to 800 nm, and thickness of acopper-manganese (CuMn) layer may be in a range from 5 nm to 200 nm.Material used in the connecting electrode layers 117 is not limited tothis example, and may be selected from appropriate electricallyconductive materials.

The interlayer insulating layer is formed from an organic compound suchas polyimide, polyamide, or an acrylic-based resin, and has a thicknessof approx. 4000 nm. However, thickness is not limited to this example,and may be in a range from 2000 nm to 8000 nm, for example.

(2) Pixel Electrode Layers 119

The pixel electrode layers 119 are made from metal material. In the caseof the display panel 10 pertaining to the present embodiment, surfacesof the pixel electrode layers 119 are preferably highly reflective. Inthe display panel 10 pertaining to the present embodiment, the pixelelectrode layers 119 may each be a structure in which a plurality oflayers are selected from metal layers, alloy layers, andlight-transmissive electrically-conductive layers. As a metal layer, ametal material including silver (Ag) or aluminium (Al) may be used, forexample. As an alloy layer, silver palladium copper alloy (APC), silverpalladium gold alloy (ARA), molybdenum chromium alloy (MoCr), or nickelchromium alloy (NiCr) may be used, for example. As a light-transmissiveelectrically-conductive material, indium tin oxide (ITO) or indium zincoxide (IZO) may be used, for example.

(3) Hole Injection Layers 120

The hole injection layers 120 are layers made from an oxide of silver(Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel(Ni), or iridium (Ir), or an electrically conductive polymer such aspoly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS).

In a case of the hole injection layers 120 being configured from atransition metal oxide, a plurality of energy levels can be obtainedfrom a plurality of valences, and as a result hole injection becomeseasier and drive voltage can be decreased.

(4) Hole Transport Layers 121

For the hole transport layers 121, a high molecular compound such aspolyfluorene, a derivative thereof, poly arylamine, or a derivativethereof may be used, for example.

(5) Banks 122

The banks 122 are formed from an organic material such as a resin andhave insulating properties. As examples of organic materials that may beused in forming the banks 122, acrylic-based resin, polyimide-basedresin, or novalac-type phenolic resin may be used. The banks 122preferably have organic solvent resistance. Further, during theproduction process, the banks 122 are subjected to an etching process, abaking process, etc., and therefore the banks 122 are preferably formedfrom a material having a high resistance to deformation, deterioration,etc., during such processes. Further, in order to impart waterrepellency to surfaces of the banks 122, the surfaces may befluorine-treated. Further, the banks 122 may be formed by using materialthat contains fluorine.

Further, structure of the banks 122 is not limited to the single-layerstructure illustrated in FIG. 4, and may be a multi-layered structurehaving two or more layers. In such a case, each layer may be acombination of the materials above, or each layer may be an inorganicmaterial and an organic material.

(6) Light-Emitting Layers 123

The light-emitting layers 123, as stated above, have a function ofemitting light generated by an excited state due to recombination ofholes and electrons injected thereto. As a material used in forming thelight-emitting layers 123 it is necessary to use a light emittingorganic material that can form a thin film by using a wet printingmethod.

For example, as disclosed in JP H5-163488, a phosphorescent material ispreferably used, such as an oxinoid compound, perylene compound,coumarin compound, azacoumarin compound, oxazole compound, oxadiazolecompound, perinone compound, pyrrolo-pyrrole compound, naphthalenecompound, anthracene compound, fluorene compound, fluoranthene compound,tetracene compound, pyrene compound, coronene compound, quinolonecompound and azaquinolone compound, pyrazoline derivative and pyrazolonederivative, rhodamine compound, chrysene compound, phenanthrenecompound, cyclopentadiene compound, stilbene compound, diphenylquinonecompound, styryl compound, butadiene compound, dicyanomethylene pyrancompound, dicyanomethylene thiopyran compound, fluorescein compound,pyrylium compound, thiapyrylium compound, selenapyrylium compound,telluropyrylium compound, aromatic aldadiene compound, oligophenylenecompound, thioxanthene compound, cyanine compound, acridine compound,metal complex of an 8-hydroxyquinoline compound, metal complex of a2-bipyridine compound, complex of a Schiff base and a group III metal,metal complex of oxine, rare earth complex, or similar.

(7) Electron Transport Layer 124

The electron transport layer 124 may be formed using an oxadiazolederivative (OXD), a triazole derivative (TAZ), or a phenanthrolinederivative (BCP, Bphen), for example.

(8) Opposing Electrode Layer 125

The opposing electrode layer 125 may be formed from indium tin oxide(ITO) or indium zinc oxide (IZO), for example. Further, silver (Ag) oraluminium (Al) may be used as a thin film electrode.

(9) Sealing Layer 126

The sealing layer 126 has a function of suppressing exposure of organiclayers such as the light-emitting layers 123 to moisture and air, andmay be formed from a light-transmissive material such as silicon nitride(SiN) or silicon oxynitride (SiON). Further, on a layer formed from amaterial such as silicon nitride (SiN) or silicon oxynitride (SiON), asealing resin layer composed of resin material such as acrylic resin orsilicone resin may be provided.

The sealing layer 126, in the case of the display panel 10 pertaining topresent embodiment, which is a top-emission type, is necessarily formedfrom a light-transmissive material.

(10) Joining Layer 127

The joining layer 127 may be made from a resin adhesive, for example.The joining layer 127 may be made from a light-transmissive resinmaterial such as acrylic resin, silicone resin, or epoxy resin.

(11) Upper Substrate 130

As a material of the upper substrate 130, a light-transmissive materialmay be used such as a glass substrate, silica glass substrate, orplastic substrate, for example.

(12) Color Filter Layers 128

As a material of the color filter layers 128, a known resin material maybe used (examples of commercial products are color resists manufacturedby JSR Co., Ltd).

(13) Light-Shielding Layer 129

As a material of the light-shielding layer 129, a resin materialincluding an ultraviolet light curable resin (for example, anultraviolet light curable acrylic resin) material as a main componentand a black pigment as an additional component may be used. As the blackpigment, a light-shielding material such as a carbon black pigment,titanium black pigment, metal oxide pigment, or organic pigment may beused.

5. Display Panel 10 Manufacturing Method

The following describes a method of manufacturing the display device 10,with reference to drawings from FIG. 6A to FIG. 9B.

(1) Forming Substrate 100 x (TFT Substrate)

First, as illustrated in FIG. 6A, a substrate 100 x 0 is prepared onwhich the source electrodes 107, 110 and the drain electrodes 108, 109are formed. The substrate 100 x 0 can be manufactured by using a knownTFT manufacturing method.

Subsequently, as illustrated in FIG. 6B, the passivation layer 116 islayered on the source electrodes 107, 110, the drain electrodes 108,109, and the channel protection layer 106, by using a plasma CVD methodor sputtering, for example.

Subsequently, as illustrated in FIG. 6C, the contact holes 116 a areopened in the passivation layer 116 at locations above the sourceelectrodes 110, by using a dry etching method. Bottoms of the contactholes 116 a are formed to expose surfaces 110 a of the source electrodes110.

Subsequently, as illustrated in FIG. 6D, the connecting electrode layers117 are formed conforming to the contours of the side walls of thecontact holes 116 a in the passivation layer 116. Upper portions of theconnecting electrode layers 117 are disposed on the passivation layer116. Sputtering may be used to forming the connecting electrode layers117, for example. After forming a metal film, patterning is performed byusing photolithography and wet etching.

Further, the interlayer insulating layer 118 is formed covering theconnecting electrode layers 117 and the passivation layer 116, byapplying the organic material and planarizing the surface thereof.

(2) Forming Pixel Electrode Layers 119

As illustrated in FIG. 6E, contact holes are opened in the interlayerinsulating layer 118 above the connecting electrode layers 117, and thepixel electrode layers 119 are formed.

Forming the pixel electrode layers 119 comprises forming a metal film byusing a method such as sputtering or vacuum deposition, followed bypatterning by using photolithography and etching. The pixel electrodelayers 119 are electrically connected to the connecting electrode layers117.

(3) Forming Hole Injection Layers 120 and Banks 122

As illustrated in FIG. 7A, the hole injection layers 120 and the holetransport layers 121 are formed on the pixel electrode layers 119 andthe banks 122 are formed covering edge portions of the hole transportlayers 121. The banks 122 surround the openings 122 a that definepixels, surfaces of the hole transport layers 121 being exposed by theopenings 122 a.

The hole injection layers 120 and the hole transport layers 121 areformed by forming films from a metal oxide (for example, tungsten oxide)by using sputtering, then patterning to each pixel by usingphotolithography and etching.

The banks 122 are formed by first forming a layer composed of a bank 122material (for example, a photosensitive resin material) on the holetransport layers 121 by using a spin coating method or similar.Subsequently, the resin layer is patterned to form the openings 122 a.Forming the openings 122 a includes arranging a mask above the resinlayer, exposure to light, and developing.

(4) Forming Light-Emitting Layers 123 and Electron Transport Layer 124

As illustrated in FIG. 7B, from the hole transport layers 121 in theopenings 122 a defined by the banks 122, the light-emitting layers 123and the electron transport layer 124 are formed in this order.

Forming the light-emitting layers 123 includes applying ink thatcontains component material into the openings 122 a defined by the banks122, and subsequently baking.

The electron transport layer 124 is formed by sputtering or similar.

(5) Forming Opposing Electrode Layer 125 and Sealing Layer 126

As illustrated in FIG. 7C, the opposing electrode layer 125 and thesealing layer 126 are formed in this order, covering the electrontransport layer 124.

The opposing electrode layer 125 and the sealing layer 126 are formed byusing CVD or sputtering, for example.

(6) Forming CF Substrate 131

The following describes a process of manufacturing the CF substrate 131,with reference to drawings from FIG. 8A to FIG. 8F.

Material of the light-shielding layer 129, including anultraviolet-curable resin (for example, an ultraviolet-curable acrylicresin) as a primary component and a black pigment added thereto isdispersed in a solvent, adjusted to a light-shielding layer paste 129X,and applied to one surface of the upper substrate 130, which islight-transmissive (FIG. 8A).

After application, the light-shielding layer paste 129X is dried, andafter the solvent has to some extent vaporized a pattern mask PM1 thathas predefined openings is overlaid on the light-shielding layer paste129X and irradiated with ultraviolet light from above (FIG. 8B).

Subsequently, the light-shielding layer paste 129X is baked, the patternmask PM1 and uncured BM paste 120X are removed and developed, and, whencured, the light-shielding layer 129 that is rectangular incross-section is completed (FIG. 8C).

Subsequently, a paste 129X is applied on a surface of the uppersubstrate 130 on which the light-shielding layer 129 is complete. Thepaste 128X is material of the color filter layers 128, a primarycomponent of which is ultraviolet-curable resin, dispersed in a solvent.After application, an amount of the solvent is removed, and a predefinedpattern mask PM2 is overlaid thereon and irradiated with ultravioletlight (FIG. 8D).

Subsequently curing is performed, the pattern mask PM2 and uncured paste128X are removed and developed to form color filter layers 128(G) (FIG.8E).

The processes of FIG. 8D and FIG. 8E are repeated for color filtermaterials of each color to form color filter layers 128(R) and colorfilter layers 128(B). Instead of using the paste 128X, a commercialcolor filter product may be used.

Thus, the CF substrate 131 is formed.

(7) Attachment of CF Substrate 131 and Rear Panel

Subsequently, material of the joining layer 127, which is primarily alight-transmissive ultraviolet-curable resin such as acrylic resin,silicone resin, or epoxy resin, is applied to a rear panel, whichconsists of each layer from the substrate 100 x to the sealing layer 126(FIG. 9A).

Subsequently, the applied material is irradiated by ultraviolet lightand the rear panel and the CF substrate 131 are then bonded to eachother, maintaining their positional relationship with each other. Atthis time, care is taken to ensure that no gas enters between the rearpanel and the CF substrate 131. Subsequently, both substrates are bakedand sealed, completing the organic EL display panel 1 (FIG. 9B).

6. Effects of Display Panel 10

6.1 Improved Light Emission Efficiency

FIG. 10 is an enlarged plan view of a portion A in FIG. 3. In theorganic EL elements 100, the self-luminous regions 100 a and thenot-self-luminous regions 100 b are arranged alternating with each otherin the column direction. The row light-shielding layers 129X, as shownin FIG. 4, are disposed in positions that do not overlap with portionsof the contact regions 119 b.

As above, according to the organic EL elements 100, only portions of thelight-emitting layers 123 that are supplied carriers from the pixelelectrode layers 119 emit light, and in the not-self-luminous regions100 b where the row banks 122X are present, which are inter-layerinsulators, electroluminescence of organic compounds does not occur.However, light emitted from the self-luminous regions 100 a of thelight-emitting layers 123 is partially transmitted in all directionswithin the light-emitting layers 123, and therefore light that leaks inthe column direction from the light-emitting layers 123 is transmittedinto the row banks 122X that are adjacent, into the not-self-luminousregions 100 b. A portion of such light is reflected upwards at thecontact regions 119 b of the pixel electrode layers 119 in thenot-self-luminous regions 100 b.

Thus, by arranging the row light-shielding layers 129X in positions thatdo not overlap with the contact regions 119 b in the not-self-luminousregions 100 b, while avoiding being above the pixel electrode layers119, light that leaks in the column direction from the light-emittinglayers 123 can be emitted upwards in the not-self-luminous regions 100b, improving light emission efficiency of the organic EL elements 100.

6.2 Suppressing Glare on Display Panel Surface Caused by Glare fromExternal Light

According to the organic EL elements 100, the column light-shieldinglayers 129Y, as shown in FIG. 5, are disposed in positions overlappingthe row-direction edge portions 119 a 3, 119 a 4 of the pixel electrodelayers 119, and the row light-shielding layers 129X, as shown in FIG. 4,are disposed in positions overlapping the column-direction edge portions119 a 1, 119 a 2 of the pixel electrode layers 119.

According to investigation by the inventors, upper surfaces of the pixelelectrode layers 119 are smooth because they are formed by a processsuch as sputtering or vacuum deposition, and external light glare fromupper surfaces other than the edge portions 119 a of the pixel electrodelayers 119 is not as visible as from the edge portions 119 a. Incontrast, the edge portions 119 a of the pixel electrode layers 119 areformed by patterning by etching, and therefore edge surfaces of the edgeportions 119 a are rougher than the upper surfaces and the edge surfacesbecome inclined away from the vertical to form trapezoidal shapes. Thus,irregular reflection occurs when external light is incident on the edgeportions 119 a of the pixel electrode layers 119, which are finelypatterned in all directions as internal surfaces of the display panel.Light reflected in all directions that is incident on the eyes of anobserver is recognized as glare on the surface of the display panel, andbecomes a factor in degradation of quality of a displayed image.

According to the organic EL elements 100, the light-shielding layer 129is disposed above the edge portions 119 a of the pixel electrode layers119, and therefore can prevent direct incidence of external light on theedge portions 119 a of the pixel electrode layers 119 as well asinterrupt emission of light reflected at the edge portions 119 a. Thus,external light glare on the display panel 10 is effectively suppressed.

Further, even when the row light-shielding layers 129X are not aboveportions of the not-self-luminous regions 100 b, light reflected fromthe edge portions 119 a of the pixel electrode layer 119, which is mostnoticeable, is shielded by disposing the light-shielding layer 129 thatincludes the row light-shielding layers 129X above the edge portions 119a of the pixel electrode layers 119, and therefore external light glaredoes not become a problem.

6.3 Other

As described above, the light-shielding layer 129 has a function ofpreventing boundaries between pixels becoming unclear by blocking aportion of light emitted from a pixel that leaks to adjacent pixels, andhas a function of increasing color purity of light emitted from pixels.

According to the organic EL elements 100, the width WX in the rowdirection of the column light-shielding layers 129Y is greater than thedistance δX in the row direction between adjacent ones of the pixelelectrode layers 119, and the width WY in the column direction of therow light-shielding layers 129X is greater than the distance δY in thecolumn direction between adjacent ones of the pixel electrode layers119. The distance δX and the distance δY between the pixel electrodelayers 119 are determined by the accuracy of etching in a manufacturingprocess of patterning the pixel electrode layers 119, and are equivalentto each other.

Thus, the width WX in the row direction of the column light-shieldinglayers 129Y and the width WY in the column direction of the rowlight-shielding layers 129X can be made equivalent to each other, andtherefore a decrease in color purity of light emitted from pixels doesnot occur when the decrease in color purity would be caused by colormixing between adjacent pixels when pixel boundaries become unclear as aresult of emitted light leaking to adjacent pixels when the rowlight-shielding layers 129X are not above portions of thenot-self-luminous regions 100 b.

6.4 Lighting Test

Lighting tests were performed on the display panel 10 incorporating theorganic EL elements 100 and luminance was measured.

FIG. 11A, FIG. 11B, and FIG. 11C are photographs captured from above theupper substrate 130, showing the pixels 100 e of the display panel 10 inplan view. FIG. 11A shows one of the self-luminous regions 100 a and oneof the not-self-luminous regions 100 b of one of the organic EL elements100 in one of the red intervals 122 zR, FIG. 11B shows one of the greenintervals 122 zG, and FIG. 11C shows one of the blue intervals 122 zB.

FIG. 12A, FIG. 12B, and FIG. 12C are photographs captured from above theupper substrate 130, showing the pixels 100 e of the display panel 10 inplan view. FIG. 12A, FIG. 12B, and FIG. 12C show the same pixels shownin FIG. 11A, FIG. 11B, and FIG. 11C, in a state of emitting light. Ineach of the red intervals 122 zR, the green intervals 122 zG, and theblue intervals 122 zB, it was confirmed that a small amount of luminancewas obtained from the not-self-luminous regions 100 b. Luminance perunit area of the not-self-luminous regions 100 b of each of theintervals was approximately 8% of luminance per unit area of theself-luminous regions 100 a of the same intervals. According to thepresent embodiment, for each interval, the area of the not-self-luminousregion 100 b is approximately 20% of the area of the self-luminousregion 100 a, and therefore an increase in luminance of approximately1.6% (0.2×0.08) was confirmed over a conventional configuration forwhich light is extracted from only the self-luminous region 100 a. Whenviewed quantitatively, this is considered to be a sufficientlysignificant amount for a rate of improvement in element levels ofluminance.

Further, according to FIG. 12A, FIG. 12B, and FIG. 12C, a significantincrease in luminance can be seen in the connecting recesses 119 c onthe pixel electrode layers 119 in the not-self-luminous regions 100 bwhen compared with peripheral regions. As above, the connecting recesses119 c are concavities in portions of the pixel electrode layers 119,recessed towards the substrate 100 x, composed of bottom portions 119 c1 and inner peripheral surface portions 119 c 2. Surfaces of the innerperipheral surface portions 119 c 2 are conical inclined slopes. Thus,lights that leaks in the column direction from the light-emitting layers123 is thought to have been effectively reflected upwards towards thenot-self-luminous regions 100 b.

Accordingly, it is preferable that, in plan view of the substrate 100 x,the row light-shielding layers 129X do not overlap with the connectingrecesses 119 c of the pixel electrode layers 119, which are forconnecting thin film transistor sources and the pixel electrode layers119.

<Modifications>

The Embodiment describes the display panel 10 pertaining to the presentembodiment, but the present invention is not limited to the embodimentdescribed above, except for essential characteristic features thereof.For example, configurations obtained by applying various modificationsthat could occur to a person having ordinary skill in the art orconfigurations of the embodiment implementing any combination ofcomponents and functions that do not depart from the scope of thepresent invention are included in the scope of the present invention.The following describes modifications of the display panel 10 asexamples of such configurations.

(1) According to the display panel 10 pertaining to the embodiment, theCF substrate 131 including the row light-shielding layers 129X and thecolumn light-shielding layers 129Y is disposed on and attached to therear panel that comprises each layer from the substrate 100 x to thesealing layer 126. However, according to the display panel 10exemplified here, the row light-shielding layers 129X and the columnlight-shielding layers 129Y may be directly disposed on the rear panel.

FIG. 13 and FIG. 14 are schematic cross-sectional views at the samepositions as A-A and B-B in FIG. 3, of an organic EL display panel 10Apertaining to this modification. As shown in FIG. 13 and FIG. 14, inorganic EL elements 100A pertaining to this modification, the rowlight-shielding layers 129X and the column light-shielding layers 129Yare not formed on the upper substrate 130. Light-shielding layers 129YAare disposed on the sealing layer 126 above peaks 122Yb of the columnbanks 122Y, extending in the column direction. Light-shielding layers129XA are disposed on the sealing layer 126 above peaks 122Xb of the rowbanks 122X, extending in the row direction.

According to Modification 1, as with the embodiment, the light-shieldinglayers 129XA and the light-shielding layers 129YA are disposed aboveperipheral portions of the pixel electrode layers 119, and thereforeglare from external light is suppressed. Further, by arranging thelight-shielding layers 129XA in positions that do not overlap with thecontact regions 119 b in the not-self-luminous regions 100 b, whileavoiding being above the pixel electrode layers 119, light that leaks inthe column direction from the light-emitting layers 123 can be emittedupwards in the not-self-luminous regions 100 b, improving light emissionefficiency of the organic EL elements 100A.

Further, according to this modification, high-precision positionaladjustment for aligning the pixels of the rear panel and thelight-shielding layer 129 of the CF substrate 131 with each other is notrequired. In particular, alignment between the rear panel and the CFsubstrate 131 can be eliminated in a configuration in which the colorfilter layers 128, which are different colors for different pixels, arenot disposed in the CF substrate 131. Further, according to thismodification, the display panel 10A achieves suppression of glare fromexternal light and improves light emission efficiency even in aconfiguration that does not include the CF substrate 131, such as atransparent display.

Further, in a configuration in which the upper substrate 130, composedof light-transmissive material, is disposed above the opposing electrodelayer 125, the row light-shielding layers 129X may be disposed on theupper substrate 130 and the light-shielding layers 129YA disposed onupper surfaces of the column banks 122Y. Alternatively, the columnlight-shielding layers 129Y may be disposed on the upper substrate 130and the light-shielding layers 129XA disposed on upper surfaces of therow banks 122X. Thus, in addition to suppression of glare from externallight and improvement of light emission efficiency, manufacturing costcan be reduced. According to this configuration, the row light-shieldinglayers 129X or the column light-shielding layers 129Y form stripes onthe upper substrate 130, and therefore, for example, die coating can beused to apply paste for the row light-shielding layers 129X or thecolumn light-shielding layers 129Y onto the upper substrate 130, whichis then baked to manufacture light-shielding layers. Thus, the processesaccording to the embodiment described above, in which light-shieldinglayer paste applied onto the upper substrate 130 is exposed toultraviolet light through the pattern mask PM1, become unnecessary.

(2) According to the display panel 10, the light-emitting layers 123extend continuously in the column direction above the row banks.However, the light-emitting layers 123 may be interrupted above the rowbanks to form discrete pixels. This configuration also suppresses glarefrom external light and improves light emission efficiency.

(3) According to the display panel 10, any two of the light-emittinglayers 123 disposed in the intervals 122 z between the column banks 122Ythat are adjacent to each other in the row direction emit differentcolors of light from each other and any two of the light-emitting layers123 disposed in the intervals 122 z between the row banks 122X that areadjacent to each other in the column direction emit the same color oflight. However, any two of the light-emitting layers 123 that areadjacent to each other in the row direction may emit the same color oflight and any two of the light-emitting layers 123 that are adjacent toeach other in the column direction may emit different colors of lightfrom each other. Further, any of the light-emitting layers 123 that areadjacent to each other in the row direction and/or the column directionmay emit different colors of light from each other. This configurationalso suppresses glare from external light and improves light emissionefficiency. Further, loss of clarity due to light emitted from pixelsleaking into adjacent pixels does not occur and a decrease in colorpurity of light emitted from pixels caused by color mixing betweenadjacent pixels does not occur.

(4) According to the display panel 10, the CF substrate 131 is, via thejoining layer 127, disposed on and attached to the rear panel thatcomprises each layer from the substrate 100 x to the sealing layer 126.Further, photo spacers may be disposed between the rear panel and the CFsubstrate 131.

The photo spacers (not illustrated) are primarily used for the purposeof adjusting spacing between the CF substrate 131 and the rear panel.For example, the photo spacers may each have a cylindrical shape with anaxis along the Z direction, each end of the cylindrical shape in the Zaxis direction being in direct contact with the CF substrate 131 or therear panel. The photo spacers are not limited to being cylindricalshapes and may be rectangular solids, spheres, etc., and may beelongated shapes like the light-shielding layers 129XA or thelight-shielding layers 129YA. When the photo spacers have elongatedshapes along the XY plane, an effect for each organic EL element ofpreventing light entering adjacent ones of the light-emitting layers 123can be achieved. A known material can be used as material of the photospacers, exemplified by a high transparency resin material such as amethacrylic acid ester. The photo spacers may be disposed at theintersections between the light-shielding layers 129XA and thelight-shielding layers 129YA in each pixel, but are not limited to thisdisposition. For example, the photo spacers may be disposed atintersections of pixels in a color display comprising sets of threecolors of the color filter layers 128.

(5) Other Modifications.

According to the display panel 10 pertaining to the embodiment there arethree colors of the pixels 100 e—red pixels, green pixels, and bluepixels—but the present invention is not limited to this. For example,one type of light-emitting layer may be used, or four types oflight-emitting layer emitting red, green, blue, and yellow light may beused.

Further, according to the embodiment, the pixels 100 e are arranged in amatrix, but the present invention is not limited to this. For example,when the interval of pixel regions is one pitch, adjacent pixel regionsmay be shifted by a half pitch in the column direction. In ahigh-definition display panel, shifting in the column direction becomesdifficult to determine by visual inspection and for straight lines (orzigzags) of a certain width, even irregularity in film thickness isperceived as being regular. Accordingly, variation in luminance can besuppressed by a zigzag alignment, improving display quality of thedisplay panel.

Further, according to the display panel 10, the pixel electrode layers119 are disposed in all of the intervals 122 z, but the presentinvention is not limited to this configuration. For example, when a busbar or similar is present, intervals 122 z in which the pixel electrodelayers 119 are not present may exist.

Further, according to the display panel 10, the color filter layers 128are formed above the intervals 122 z of the pixels 100 e of each color.However, the display panel 10 may be configured without the color filterlayers 128 above the intervals 122 z.

Further, according to the embodiment, the hole injection layers 120, thehole transport layers 121, the light-emitting layers 123, and theelectron transport layer 124 are formed between the pixel electrodelayers 119 and the opposing electrode layer 125, but the presentinvention is not limited to this. For example, a configuration may beused in which only the light-emitting layers 123 are between the pixelelectrode layers 119 and the opposing electrode layer 125, without usingthe hole injection layers 120, the hole transport layers 121, or theelectron transport layer 124. Further, for example, a configuration mayinclude hole injection layers, hole transport layers, an electrontransport layer, an electron injection layer, or some or all of these.Further, these layers need not all be composed of organic compounds, andmay be composed of inorganic materials, etc.

Further, according to the embodiment, as methods of forming thelight-emitting layers 123, wet processes such as printing, spin coating,and inkjets are used, but the present invention is not limited to these.For example, dry processes such as vacuum deposition, electron beamdeposition, sputtering, reactive sputtering, ion plating, and vaporphase growth may be used. Further, known materials may be appropriatelyapplied as materials of each element.

According to the embodiment, the pixel electrode layers 119, which areanodes, are disposed in lower portions of EL elements and TFT sourceelectrodes 110 are connected to the pixel electrode layers 119. However,a configuration may be applied in which the opposing electrode layer maybe disposed in the lower portions of the EL elements and an anodedisposed at the upper portions. In this case, the drains of the TFT areconnected to the cathode disposed in the lower portion.

Further, according to the embodiment, a configuration is used in whichtwo transistors Tr1, Tr2 are supplied for each of the pixels 100 e, butthe present invention is not limited to this. For example, aconfiguration may be used in which one transistor is supplied for eachsub-pixel, or three or more transistors are supplied for each sub-pixel.

Further, according to the embodiment, a top-emission type of EL displaypanel is given as one example, but the present invention is not limitedto this. For example, a bottom-emission type of display panel may beused. In such cases each configuration may be modified as appropriate.

Further, according to the embodiment, the display panel 10 is an activematrix, but the present invention is not limited in this way. Forexample, a passive matrix may be used. More specifically, straight lineelectrodes parallel to the column direction and straight line electrodesparallel to the row direction may surround the light-emitting layers123. In such cases each configuration may be modified as appropriate.According to the embodiment, the substrate 100 x includes a TFT layerbut as described above in the example of a passive matrix, the substrate100 x may be configured without a TFT layer.

<<Review>>

The organic EL display panel pertaining to the present embodiment is anorganic EL display panel in which a plurality of pixels are arranged ina row direction and a column direction in a matrix, the organic ELdisplay panel including: a substrate 100 x; a plurality of pixelelectrode layers 119 arranged in the row direction and the columndirection in a matrix on the substrate 100 x, the pixel electrode layers119 including a light-reflective material; a plurality of column banks122Y disposed on the substrate 100 x and on the pixel electrode layers119, covering row-direction edge portions 119 a 3, 119 a 4 of the pixelelectrode layers 119, extending in the column direction, arrangedside-by-side in the row direction, and defining row-direction edges ofself-luminous regions 100 a of the pixels; a plurality of row banks 122Xdisposed on the substrate 100 x and on the pixel electrode layers 119,covering column-direction edge portions 119 a 1, 119 a 2 of the pixelelectrode layers 119 and contact regions 119 b of the pixel electrodelayers 119 that are for electrically connecting the pixel electrodelayers 119, extending in the row direction, arranged side-by-side in thecolumn direction, and defining column-direction edges of theself-luminous regions 100 a; a plurality of light-emitting layers 123disposed above the pixel electrode layers 119 in intervals 122Z betweenadjacent ones of the column banks 122Y; an opposing electrode layer 125disposed above the light-emitting layers 123, the opposing electrodelayer 125 including a light-transmissive material; a plurality of columnlight-shielding layers 129Y disposed higher than the pixel electrodelayers 119, extending in the column direction, arranged side-by-side inthe row direction, and overlapping the row-direction edge portions 119 a3, 119 a 4 of the pixel electrode layers 119 in plan view of thesubstrate 100 x; and a plurality of row light-shielding layers 129Xdisposed higher than the pixel electrode layers 119, extending in therow direction, arranged side-by-side in the column direction,overlapping the column-direction edge portions 119 a 1, 119 a 2 of thepixel electrode layers 119 and partially overlapping the contact regions119 b in plan view of the substrate 100 x.

According to this configuration, an organic EL element that improvessuppression of glare from external light on a display surface andimproves light emission efficiency and an organic EL display panel usingthe organic EL element can be provided.

<Supplement>

The embodiment described above represents one preferred example of thepresent invention. Values, shapes, materials, components, componentpositions and connections, processes, process sequences, etc.,exemplified by the embodiment are all examples, and are not intended tolimit the present invention. Further, elements of the embodiment thatare not recited in independent claims that represent topmost concepts ofthe present invention are described as optional elements constituting apreferred embodiment.

Further, the sequence in which processes are described as being executedis an illustrative example for describing the present invention, andsequences other than those described may be used. Further, a portion ofthe processes described may be executed simultaneously (in parallel)with another process or other processes.

Further, in order to aid understanding of the invention, the scale ofelements in the drawings referenced by the embodiment may differ fromactual implementation. Further, the present invention is not limited tothe description of the embodiment and may be modified appropriatelywithout departing from the scope of the present invention.

Further, at least a portion of the functionality of the embodiment andthe modifications may be combined.

Further, various modifications to the embodiment that may occur to aperson having ordinary skill in the art are also included in the scopeof the present invention.

Although the present invention has been fully described by way ofexamples with reference to the accompanying drawings, it is to be notedthat various changes and modifications will be apparent to those skilledin the art. Therefore, unless such changes and modifications depart fromthe scope of the present invention, they should be construed as beingincluded therein.

The invention claimed is:
 1. An organic EL display panel in which aplurality of pixels are arranged in a row direction and a columndirection in a matrix, the organic EL display panel comprising: asubstrate; a plurality of pixel electrode layers arranged in the rowdirection and the column direction in a matrix on the substrate, thepixel electrode layers including a light-reflective material; aplurality of column banks disposed on the substrate and on the pixelelectrode layers, covering row-direction edge portions of the pixelelectrode layers, extending in the column direction, arrangedside-by-side in the row direction, and defining row-direction edges ofself-luminous regions of the pixels; a plurality of row banks disposedon the substrate and on the pixel electrode layers, coveringcolumn-direction edge portions of the pixel electrode layers and contactregions of the pixel electrode layers that are for electricallyconnecting the pixel electrode layers, extending in the row direction,arranged side-by-side in the column direction, and definingcolumn-direction edges of the self-luminous regions; a plurality oflight-emitting layers disposed above the pixel electrode layers inintervals between adjacent ones of the column banks; an opposingelectrode layer disposed above the light-emitting layers, the opposingelectrode layer including a light-transmissive material; a plurality ofcolumn light-shielding layers disposed higher than the pixel electrodelayers, extending in the column direction, arranged side-by-side in therow direction, and overlapping the row-direction edge portions of thepixel electrode layers in a plan view of the substrate; and a pluralityof row light-shielding layers disposed higher than the pixel electrodelayers, extending in the row direction, arranged side-by-side in thecolumn direction, overlapping the column-direction edge portions of thepixel electrode layers and partially overlapping the contact regions inthe plan view of the substrate.
 2. The organic EL display panel of claim1, further comprising: a plurality of thin-film transistors arranged inthe row direction and the column direction in a matrix in the substrate,in positions corresponding to the pixels, wherein sources or drains ofthe thin-film transistors are connected to the pixel electrode layersvia connecting recesses in which portions of the pixel electrode layersin the contact regions are recessed in a direction of the substrate, andin the plan view of the substrate, the row light-shielding layers do notoverlap with the connecting recesses.
 3. The organic EL display panel ofclaim 1, wherein the light-emitting layers extend continuously in thecolumn direction above the row banks.
 4. The organic EL display panel ofclaim 1, wherein the light-emitting layers are interrupted by the rowbanks.
 5. The organic EL display panel of claim 1, wherein any two ofthe light-emitting layers disposed in the intervals between the columnbanks that are adjacent to each other in the row direction emitdifferent colors of light from each other.
 6. The organic EL displaypanel of claim 4, wherein any one of the light-emitting layersinterrupted by the row banks in the column direction emits a same colorof light along a length in the column direction.
 7. The organic ELdisplay panel of claim 1, further comprising: an upper substratedisposed above the opposing electrode, the upper substrate including alight-transmissive material, wherein the row light-shielding layers, thecolumn light-shielding layers, or both the row light-shielding layersand the column light-shielding layers are disposed in direct contactwith the upper substrate.
 8. The organic EL display panel of claim 1,wherein the column light-shielding layers are disposed on upper surfacesof the column banks.
 9. The organic EL display panel of claim 1, whereinthe row light-shielding layers are disposed on upper surfaces of the rowbanks.
 10. An organic EL element, comprising: a substrate; a thin filmtransistor disposed in the substrate; a pixel electrode layer disposedon the substrate, the pixel electrode layer including a light-reflectivematerial; banks disposed on the substrate and on the pixel electrodelayer, covering edge portions of the pixel electrode layer and a portionof a contact region of the pixel electrode layer, the contact regionbeing for electrically connecting the pixel electrode layer; alight-emitting layer disposed above the pixel electrode layer; anopposing electrode layer disposed above the light-emitting layer, theopposing electrode layer including a light-transmissive material; and alight-shielding layer disposed higher than the pixel electrode layer,the light-shielding layer overlapping the edge portions of the pixelelectrode layers and partially overlapping the contact region in a planview of the substrate, wherein a source or a drain of the thin-filmtransistor is connected to the pixel electrode layer via a connectingrecess in which a portion of the pixel electrode layer in the contactregion is recessed in a direction of the substrate, and in the plan viewof the substrate, the light-shielding layer does not overlap with theconnecting recess.
 11. A method of manufacturing an organic EL displaypanel, the method comprising: preparing a substrate; disposing aplurality of pixel electrode layers in a row direction and a columndirection in a matrix on the substrate, the pixel electrode layersincluding a light-reflective material; disposing a plurality of columnbanks on the substrate and on the pixel electrode layers, the columnbanks covering row-direction edge portions of the pixel electrodelayers, extending in the column direction, and arranged side-by-side inthe row direction; disposing a plurality of row banks on the substrateand on the pixel electrode layers, the row banks coveringcolumn-direction edge portions of the pixel electrode layers, extendingin the row direction, and arranged side-by-side in the column direction;disposing a plurality of light-emitting layers above the pixel electrodelayers in intervals between adjacent ones of the column banks; disposingan opposing electrode layer above the light-emitting layers, theopposing electrode layer including a light-transmissive material;disposing, higher than the pixel electrode layers, a plurality of columnlight-shielding layers extending in the column direction, arrangedside-by-side in the row direction, and overlapping the row-directionedge portions of the pixel electrode layers in a plan view of thesubstrate; and disposing, higher than the pixel electrode layers, aplurality of row light-shielding layers extending in the row direction,arranged side-by-side in the column direction, overlapping thecolumn-direction edge portions of the pixel electrode layers andpartially overlapping contact regions of the pixel electrode layers inthe plan view of the substrate.